本书特色：均衡了不同背景的学生(机械工程系学生和电子工程系学生)的需求。均衡地讨论了MEMS基础知识的三个支柱：设计、制造和材料。均衡地安排了理论基础和实践。书中提炼出了四个典型的传感器实例：惯性传感器、压力传感器、流量传感器和触觉传感器，并介绍了利用不同原理、材料和工艺制造这些传感器的方法。

本书全面论述了微机电系统(MEMS)的基础知识，涵盖了MEMS技术的主要方面。同时引用了经典的MEMS研究论文和前沿的研究论文，为学生深入学习MEMS技术提供了指引。书中提炼出了四个典型的传感器实例：惯性传感器、压力传感器、流量传感器和触觉传感器，并介绍了利用不同原理、材料和工艺制造这些传感器的方法，既便于比较，又可以启发学生的创新意识并提高创新能力。

本书被美国伊利诺伊大学、斯坦福大学等选为教材。

PREFACE

A NOTE TO INSTRUCTORS

ABOUT THE AUTHOR

NOTATIONAL CONVENTIONS

Chapter 1 Introduction

　1.0 Preview

　1.1 The History of MEMS Development

　1.2 The Intrinsic Characteristics of MEMS

　　1.2.1 Miniaturization

　　1.2.2 Microelectronics Integration

　　1.2.3 Mass Fabrication with Precision

　1.3 Devices: Sensors and Actuators

　　1.3.1 Energy Domains and Transducers

　　1.3.2 Sensors

　　1.3.3 Actuators

　　Summary

　　Problems

　　References

Chapter 2 Introduction to Microfabrication

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　2.1 Overview of Microfabrication

　2.2 The Microelectronics Fabrication Process

　2.3 Silicon-Based MEMS Processes

　2.4 New Materials and Fabrication Processes

　2.5 Points of Consideration for Processing

　　Summary

　　Problems

　　References

Chapter 3 Review of Essential Electrical and Mechanical Concepts

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　3.1 Conductivity of Semiconductors

　　3.1.1 Semiconductor Materials

　　3.1.2　Calculation of Charge Carrier Concentration

　　3.1.3 Conductivity and Resistivity

　3.2 Crystal Planes and Orientation

　3.3 Stress and Strain

　　3.3.1 Internal Force Analysis: Newton's Laws of Motion

　　3.3.2　Definitions of Stress and Strain

　　3.3.3 General Scalar Relation Between Tensile Stress and Strain

　　3.3.4 Mechanical Properties of Silicon and Related Thin Films

　　3.3.5　General Stress-Strain Relations

　3.4 Flexural Beam Bending Analysis Under Simple Loading Conditions

　　3.4.1 Types of Beams

　　3.4.2 Longitudinal Strain Under Pure Bending

　　3.4.3　Deflection of Beams

　　3.4.4　Finding the Spring Constants

　3.5 Torsional Deflections

　3.6 Intrinsic Stress

　3.7 Resonant Frequency and Quality Factor

　3.8 Active Tuning of the Spring Constant and Resonant Frequency

　3.9 A List of Suggested Courses and Books

　　Summary

　　Problems

　　References

Chapter 4 Electrostatic Sensing and Actuation

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　4.1 Introduction to Electrostatic Sensors and Actuators

　4.2 Parallel-Plate Capacitors

　　4.2.1 Capacitance of Parallel Plates

　　4.2.2 Equilibrium Position of Electrostatic Actuator Under Bias

　　4.2.3 Pull-In Effect of Parallel-Plate Actuators

　4.3 Applications of Parallel-Plate Capacitors

　　4.3.1 Inertia Sensor

　　4.3.2 Pressure Sensor

　　4.3.3 Flow Sensor

　　4.3.4 Tactile Sensor

　　4.3.5 Parallel-Plate Actuators

　4.4 Interdigitated Finger Capacitors

　4.5 Applications of Comb-Drive Devices

　　4.5.1 Inertia Sensors

　　4.5.2 Actuators

　　Summary

　　Problems

　　References

Chapter 5 Thermal Sensing and Actuation

Chapter 6 Piezoresistive Sensors

Chapter 7 Piexoelectric Sensing and Actuation

Chapter 8 Magnetic Actuation

Chapter 9 Summary of Sensing and Actuation

Chapter 10 Bulk Micromachining and Silicon Anisotropic Etching

Chapter 11 Surface Micromachining

Chapter 12 Polymer MEMS

Chapter 13 Microfluidics Applications

Chapter 14 Instruments for Scanning Probe Microscopy

Chapter 15 Optical MEMS

Chapter 16 MEMS Technology Management

Appendix A Material Properties

Appendix B　Frequently Used Formulas for Beams and Membranes

Index