固体照明其主要优势是节能、环境友好和长寿命，而LED（发光二极管）封装是获得这些优点的主要保障技术。本书不仅涵盖照明、色度学、光度学、发光二极管的基本原理，同时全面介绍了LED晶圆和芯片的制程、LED芯片封装、LED晶圆级封装、板级组装与LED模组、光学与电学表征、热管理、可靠性、以及封装材料等相关内容。尤其重点阐述了LED封装中的关键技术如互连、荧光粉沉积、塑封等。LED在通用固体照明和特殊照明中的应用也是本书的重点。还讨论了技术线路图有关内容。本书中大量的技术内容是作者的实践成果和实验成果，具有很强的产业化实践指导意义。读者将会从书中的工艺过程及实验数据中获益。
本书适合从事LED设计、材料研发、封装和组装工艺、可靠性测试和应用等的高校及科研院所的研究人员、研究生、工程师及技术经理使用。

李世玮，获美国普渡大学航空航天工程博士学位。1993年加入香港科技大学(下称港科大)，现任港科大机械及航空航天工程系讲席教授，港科大佛山智能制造研究院院长，港科大广州校区系统枢纽院长。美国机械工程师学会(ASME)、电气与电子工程师学会(IEEE)及国际微电子与封装学会(IMAPS)会士。曾任IEEE CPMT(封装与制造技术学会)全球会长。研究方向包括集成电路与光电器件的异构集成及微系统封装。

Preface
About the Authors
1 LEDs for Solid-State Lighting
1.1 Introduction
1.2 Evolution of Light Sources and Lighting Systems
1.3 Historical Development of LEDs
1.4 Implementation of White Light Illumination with an LED
1.5 LEDs for General Lighting
References
2 Packaging of LED Chips
2.1 Introduction
2.2 Overall Packaging Process and LED Package Types
2.2.1 PTH LED Component
2.2.2 SMD LED Component
2.3 Chip Mounting and Interconnection
2.3.1 Die Attach Adhesive
2.3.2 Soldering and Eutectic Bonding
2.3.3 Wire Bonding
2.3.4 Flip-Chips
2.4 Phosphor Coating and Dispensing Process
2.4.1 Dispersed Dispensing
2.4.2 Conformal Coating
2.4.3 Remote Phosphor
2.5 Encapsulation and Molding Process
2.5.1 Encapsulant Filling with Lens
2.5.2 Lens Molding
2.6 Secondary Optics and Lens Design
References
3 Chip Scale and Wafer Level Packaging of LEDs
3.1 Introduction
3.2 Chip Scale Packaging
3.3 Enabling Technologies for Wafer Level Packaging
3.3.1 Photolithography
3.3.2 Wafer Etching
3.3.3 TSV Filling
3.3.4 Bond Pad Metallization
3.3.5 Wafer Level Phosphor Deposition Methods
3.3.6 Moldless Encapsulation
3.4 Designs and Structures of LED Wafer Level Packaging
3.4.1 Reflective Layer Design
3.4.2 Cavity and Reflective Cup by Wet Etching
3.4.3 Copper-Filled TSVs for Vertical Interconnection and Heat Dissipation
3.5 Processes of LED Wafer Level Packaging
3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots
3.5.2 Case 2: LED WLP with a Cavity
3.5.3 Case 3: Applications of an LED WLP Panel
References
4 Board Level Assemblies and LED Modules
4.1 Introduction
4.2 Board Level Assembly Processes
4.2.1 Metal Core Printed Circuit Board
4.2.2 Printed Circuit Board with Thermal Vias
4.2.3 Wave Soldering
4.2.4 Surface Mount Reflow
4.3 Chip-on-Board Assemblies
4.4 LED Modules and Considerations
References
5 Optical, Electrical, and Thermal Performance
5.1 Evaluation of Optical Performance
5.1.1 Basic Concepts of Radiometric and Photometric
5.1.2 Irradiance Measurement Calibration
5.1.3 Common Measurement Equipment
5.2 Power Supply and Efficiency
5.2.1 Electrical Characteristics of LED
5.2.2 Power Supply for LEDs
5.2.3 Power Efficiency
5.3 Consideration of LED Thermal Performance
5.3.1 Thermal Characterization Methods for LEDs
5.3.2 Thermal Management Methods
References
6 Reliability Engineering for LED Packaging
6.1 Concept of Reliability and Test Methods
6.1.1 Reliability of Electronic Components or Systems
6.1.2 Common Failure Mechanisms and Reliability Tests
6.2 Failure Analysis and Life Assessment
6.2.1 Methodology for Failure Analysis
6.2.2 Weibull Analysis and Acceleration Model for Life Assessment
6.3 Design for Reliability
References
7 Emerging Applications of LEDs
7.1 LEDs for Automotive Lighting
7.1.1 Development
7.1.2 Typical Structures
7.1.3 Challenges
7.1.4 Conclusion
7.2 Micro- and Mini-LED Display
7.2.1 Development
7.2.2 Typical Structures
7.2.3 Challenges
7.2.4 Conclusion
7.3 LED for Visible Light Communication
7.3.1 Development
7.3.2 Typical Applications
7.3.3 Challenges
7.3.4 Conclusion
References
8 LEDs Beyond Visible Light
8.1 Applications of UV LED
8.1.1 Structures
8.1.2 Applications
8.1.3 Challenges
8.1.4 Conclusion
8.2 Applications of IR-LEDs
8.2.1 Structures
8.2.2 Applications
8.2.3 Challenges
8.2.4 Conclusion
8.3 Future Outlook and Other Technology Trends
8.3.1 Better Light Sources
8.3.2 Interconnection
8.3.3 Interaction with Humans
8.3.4 Light on Demand
References
Index